Hunan More Than Moore Advanced Semiconductor Co., Ltd.-体育网站

Product Center

Home > Product Center > fcBGA Package

RfcBGA Packaging

Filp Chip packagingprocess can choose 4-16 layer substrate with ABF and PP that supports , single chip and multi chips packaging solutions. with different ...
HfcBGA Packaging

Filp Chip packaging product can use 4-16 layer substratewith ABF and PP which can meets single chip and multi chip integrated packaging with different ball ...

" class="hidden">京瓷办公信息系统(中国)有限公司